Amd Sp3 Passive 1u Server Cpu Heatsink For Desktop Computers

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Model No:: AMD SP3 1U-C11

CPU Support:: AMD SP3 CPU

CPU Socket:: SP3

Application:: 1U Server

Payment:: T/T, L/C /Paypal

Delivery time :: 3-15 days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	AMD SP3 1U-C11	Fin pitch	1.5mm
CPU Socket type	AMD SP3 CPU Narrow socket	CPU TDP	205W
Server Form Factor	1U Server	Voltage Rating	12V DC
CPU Cooler dimensions	1208026 mm	Heatsink material	Aluminium stacked fins+copper base + 3 heat pipes
Weight	200g	Cooling Type	Passive
Fin Thickness	0.3mm	Process	Stamping, Soldering, CNC machining

▋Product Description

AMD SP3 Passive 1U Server Cpu heatsink For Desktop Computers

Lori AMD SP3 1U-C11 Server Cpu heatsink is designed for AMD SP3 CPU Server Processor, AMD SP3 CPU Narrow socket, Aluminum stacked fin soldered on the copper base with 3 heat pipes up to TDP 205W for 1U server solution. The AMD SP3 Cpu heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

part.1

Three heat pipes are adopted for better heat conduction and thermal performace. The three heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.

part.2

The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

part.3

Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency,

part.4

Inlaid copper bottom, aluminum fin, electroplated chemical nickel, uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance

part.5

Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon.The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.

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