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▋Product Specifications
Model No | LGA 7529 R11 | CPU TDP | 350W |
CPU Socket Type | LGA 7529 socket | Server Form Factor | 1U Server |
CPU Cooler Dimensions | 126.8 x 97.8 x 25 mm | Voltage Rating | 12V DC |
Fin Thickness | 0.3mm | CPU Hole Spacing | 81mm*69mm |
Fin Spacing | 1.5mm | Cooling Type | Passive |
Cooler Materials | Aluminum fins+copper base + 5 heat pipes | Process | Stamping, soldering , CNC maching |
▋Product Description
Lori Best LGA7529 1U Server Passive CPU Heat Sink
This Intel 1U Active Cpu Heat Sink is designed for Intel Server Processor, socket LGA 7529, aluminum fins with 5 heat pipes embedded and soldered on the copper base up to TDP 500W for 1U server solution. The Lori Intel Lga 7529 1u Active Cpu Heat Sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
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