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▋Product Specifications
Model No | LGA2011/2066-1U-P11 | Fin Thickness | 0.35mm |
CPU Socket type | LGA2011 square and LGA2066 sockets | Fin pitch | 1.9 mm |
Server Form Factor | 1U Server | TDP | 95W |
CPU Cooler dimensions | 88*88*25mm | CPU pitch-row | 80*80mm |
Weight | 450 G | Heatsink material | Copper base + Copper skiving fin |
Voltage | 12V | Cooling Type | Passive |
▋Product Details
Lori high performance passive1u heatsink is designed for CPUs, AI and other high-powered processors that fit the Intel LGA2011 square and LGA2066 sockets. These straight copper fin heat sinks feature optimized fin designs to meet a wide range of requirements as well as an optional standard back plate to accommodate the cooling of any high powered device. Lori’s high performance passive heatsink promote a true 1U design, making it the ideal for 1U systems with open airflow front to back. These heatsinks are available in a passivated with copper fin and anodized finish with aluminum heatsink fins to reduce weight or in a nickel-plated finish with copper fins to reduce diffusion resistance.
Designed for CPUs and other processes that fit the Intel LGA2011 square and LGA2066 sockets
Optimized heatsink fin designs to cover wide range of requirements
The 1u heatsink Installed hardware provides up to 9.2PSI pressure
The Lga2011 and Lga2066 passive heatsink designed for 1u cooling
The fanless heatsink with pptional standard back plate to accommodate cooling of any highpowered device
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