Intel Cpu Lga1700 1u Server Passive Pure Copper Skiving Fin Heatsink

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Intel Cpu Lga1700 1U Server Passive Pure Copper Skiving Fin Heatsink

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Model No:: LGA 1700-1U-P1

CPU Support:: Intel CPU

CPU Socket:: Socket LGA1700 square

Application:: 1U Server

Payment:: T/T, L/C /Paypal

Delivery time :: 3-15 days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA1700-1U-P1	Fin Thickness	0.3mm
CPU Socket type	LGA1700 Square Socket	Fin pitch	2.1mm
Server Form Factor	1U Server	TDP	125W
CPU Cooler dimensions	888825mm	CPU pitch-row	78*78mm
Weight	450 G	Heatsink material	copper skived fin + copper base
Voltage	12V	Cooling Type	Passive

▋Product Details

Part1. Precision Skiving process

High precision tight joint, fine workmanship, so that the distance of each copper skived fin is same, the air flow evenly and smoothly through each piece of skived fin, enhance the heat dissipation performance, with one-time molding, no loss of heat dissipation performance, good heat dissipation effect.

Part 2. 25mm height with thin fins

Height is only 25 mm structure design, Good cooling performance, suitable for small space and compact size CPU heat dissipation.

Part 3. Copper base conducts heat rapidly

Copper base zero distance contact, good for the first time to conduct around the heat generated by the CP. Attach to CPU heating core, absorb and conduct every minute of heat in time

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