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▋Product Specifications
Model No | LGA3647-1U-A21 | Fin pitch | 2.04mm |
CPU Socket type | LGA3647 Narrow | CPU TDP | 195W |
Server Form Factor | 2U Server | Voltage Rating | 12V DC |
CPU Heatsink dimensions | 108 x 78 x 64 mm | Heatsink material | Aluminium stacked fins+copper base+4 heat pipes |
Weight | 350g | Cooling Type | Passive |
Fin Thickness | 0.4mm | Process | Stamping, Soldering, CNC machining |
CPU Support | Intel Xeon Scalable Processors(Intel® Xeon® Gold 6138P Processor) |
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