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Intel Lga 1151/1156/ 11551U Server Copper Passive Cpu Heatsink Lori

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Intel Lga 1151/1156/ 11551U Server Copper Passive Cpu Heatsink Lori
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Model No:
LGA115X-1U-P11
CPU Support:
Intel Cpu
CPU Socket:
LGA115X Square Socket
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model No

LGA115X-1U-P11

Fin pitch

1.9mm

CPU Socket type

LGA115X Square

CPU TDP

100W

Server Form Factor

1U Server

Voltage Rating

12V DC

CPU Cooler dimensions

88 x 88 x 23 mm

Heatsink material

Copper skiving fin + copper base

Weight

431.18g

Cooling Type

Passive

Fin Thickness

0.35mm

Process

Skiving, CNC machining


Product Description

Intel lga 1155 heatsink
Intel Lga 1151/1155/1156 1U Server Copper Passive Cpu Heatsink 


This Lori P11 lga 1155 passive heatsink is designed for Intel process, LGA 1156/1155/1151 square socket . The intel lga 1155 heatsink with skiving fins and copper base For 1U server solution, Support 100 Watts CPU Power Heat Dissipation. The 1u copper heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

1u copper heatsink
       
Part 1. Skiving fin technology
The 1u copper heatsink with high precision tight joint, fine workmanship, so that the distance of each skiving fin is consistent, the air flow evenly and smoothly through each piece of skiving fin, enhance the thermal performance, with one-time molding, No loss of heat dissipation performance, good heat dissipation effect.

Copper cpu heatsink

       
Part 2. 23mm Thin Height 
The copper cpu heatsink's height is only 23mm structure design, good cooling performance, suitable for compact space and small size CPU heat dissipation.
Lga 1155 passive heatsink
       
Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

The 7762 thermal grease imported of the Lga 1155 passive heatsink from Japan is high performance silicon. Nickel plating Nickel plating process for increased beauty and oxidation resistance

Lga 1155 1U passive heatsink
       
Part 4. Copper base conducts heat rapidly
Zero distance contact of copper base is conducive to the heat generated by CPU to conduct around in the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.
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