This liquid cooling water block is an ultimate heat dissipation solution specially designed for the Intel LGA 9324 high-end platform. The TDP has a heat dissipation capacity of 550W and is particularly suitable for Intel Xeon server processors. It can reduce the risk of thermal frequency reduction in the server system and significantly extend the service life of the hardware.

Core advantages:

1. With a 550W extreme cooling performance, it can easily handle the demanding heat dissipation requirements of overclocking, 3D rendering and AI computing.

2. Microchannel design, with a dense fin structure, increases the heat dissipation area by 30% and enhances the heat conduction efficiency by 40%.

3. Compatible with LGA9324 slots, the fully covered copper base perfectly matches the new generation of Intel Xeon server processors.

4. Compact architecture, compatible with mainstream chassis and split water cooling systems.

5. Aerospace-grade durable material, nickel-plated anti-corrosion copper base.