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Lga1700 1U Server Cpu Passive Vapor Chamber Heatsink

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Lga1700 1U Server Cpu Passive Vapor Chamber Heatsink
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Model No:
LGA1700-N11-A
CPU Support:
Intel Cpu
CPU Socket:
Socket LGA1700 square
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA1700-N11-AFin pitch1.36 mm
CPU Socket typeLGA1700 CPU Square socketCPU TDP180 W
Server Form Factor1U ServerVoltage Rating12V DC
CPU Heatsink dimensions90*90*25.5 mmHeatsink materialAluminium fins+Vapor Chamber
Cpu hole pitch78mm*78mmCooling TypePassive
Fin Thickness0.25mmProcessStamping, Soldering, CNC machining


Product Description

Lga1700 heatsink
Lga1700 1U Server Cpu Passive Vapor Chamber Heatsink


The 1u cpu heatsink is designed for intel lga1700 cpu server processor, Lga1700 square socket, the lga1700 heatsink is aluminum fins soldered on the vapor chamber up to TDP 180W for 1U server solution. This lga1700 1u cpu heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

1u cpu heatsink
       
Part 1. Fine zipper fin technology
High precision tight joint, fine workmanship, so that the distance of each fin is consistent, the air flow evenly and smoothly through each fin, enhance the heat dissipation performance, with one-time molding, non-loss type heat dissipation performance, good heat dissipation effect.

Intel 1700 cooler
       
Part 2. 25mm thin height
The height of the server cpu heatsink is only 25mm structure design, good cooling performance, suitable for compact space and small size CPU heat dissipation.
Lga1700 passive heatsink
       
Part 3. Using reflow soldering process 
This lga1700 passive heatsink adopts Better contact, stable thermal conductivity, high thermal conversion rate, efficient heat dissipation. The heat dissipation fin and base adopt reflow soldering process, high precision tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to heat dissipation fin.
Vapor chamber heatsink
       
Part 4. Vapor chamber heatsink

1. The upper and lower copper sheets of vapor chamber are made of oxygen-free copper, and the capillary structure is made of copper powder sintering process

2. The temperature difference measured at any two points of the plate can be less than 5℃, and the heat conduction effect is more uniform than that of the heat conduit.

3. It has the advantages of low expansion thermal resistance, uniform heat flux, rapid heat diffusion and light weight.


Lga1700 heatsink
       
Part 3. Copper base conducts heat rapidly
The lga1700 heatsink's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around the first time. Attach to CPU heating core, absorb and conduct every minute of heat in time
Product Message
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