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▋Product Specifications
Model No | LGA3647-2U-A21 | CPU TDP | 205 W |
CPU Socket Type | Lga 3647 cpu socket | Server Form Factor | 2U Server |
CPU Cooler Dimensions | 108*78*64mm | Voltage Rating | 12V DC |
Weight | 450g | Process | Stamping, CNC machining |
Fin Thickness | 0.4mm | Fan Connector | 4pin PWM |
Fin pitch | 2.04mm | Cooler Materials | Aluminum fins+ Copper base + 4 heat pipes |
Cooling Type | Passive | Thermal Grease | Shin-Etsu 7762 Pre-printed |
▋Product Description
Lori A21 Intel Xeon W Processor Socket Lga 3647 ILM 2u Passive Workstation Cpu Heat Sink TDP 205W
This Lga 3647 ILM 2u Passive Cpu Heat Sink is designed for Intel Xeon W Server Processor, socket LGA 3647, aluminum fins with 4 heat pipes embedded and soldered on the copper base up to TDP 500W for 2U server solution. The Lori Intel LGA 3647 Socket 2U Server CPU Heat Sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
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