Passive Intel Lga 1851 1U Server Vapor Chamber Cpu Heat Sink

▋Product Specifications

Model No	LGA1851-N11-A	Fin pitch	1.36 mm
CPU Socket type	LGA1851 CPU Square socket	CPU TDP	180 W
Server Form Factor	1U Server	Voltage Rating	12V DC
CPU Cooler dimensions	909025.5 mm	Heatsink material	Aluminium fins+Vapor Chamber
Cpu hole pitch	78mm*78mm	Cooling Type	Passive
Fin Thickness	0.25mm	Process	Stamping, Soldering, CNC machining

▋Product Description

The Intel lga 1851 heat sink is designed for intel lga 1851 Cpu Server Processor, LGA 1851 square socket, the intel 1851 heat sink is aluminum fins soldered on the vapor chamber up to TDP 180W for 1U server solution. This lga 1851 heat sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. Fine zipper fin technology

High precision tight joint, fine workmanship, so that the distance of each fin is consistent, the air flow evenly and smoothly through each fin, enhance the heat dissipation performance, with one-time molding, non-loss type heat dissipation performance, good heat dissipation effect.

Part 2. 25mm thin height

The height of the Intel 1851 heat sink is only 25mm structure design, good cooling performance, suitable for compact space and small size CPU heat dissipation.

Part 3. Using reflow soldering process

This intel lga 1851 cpu heat sink adopts Better contact, stable thermal conductivity, high thermal conversion rate, efficient heat dissipation. The heat dissipation fin and base adopt reflow soldering process, high precision tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to heat dissipation fin.

Part 4. Using vapor chamber

1. The upper and lower copper sheets are made of oxygen-free copper, and the capillary structure is made of copper powder sintering process

2. The temperature difference measured at any two points of the plate can be less than 5℃, and the heat conduction effect is more uniform than that of the heat conduit.

3. It has the advantages of low expansion thermal resistance, uniform heat flux, rapid heat diffusion and light weight.

Part 3. Copper base conducts heat rapidly

The intel lga 1851 heat sink's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around the first time. Attach to CPU heating core, absorb and conduct every minute of heat in time

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