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Active 1U Server Intel Lga 1151 Cpu Cooler P13

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Active 1U Server Intel Lga 1151 Cpu Cooler P13
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Model No:
LGA115X-1U-P13
CPU Support:
Intel Cpu
CPU Socket:
LGA115X Square Socket
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Product Specifications

Model No

LGA115X-1U-P13

TDP95 W
CPU Socket typeLGA1151/1155/1156 Square Intel Socket Voltage Rating12V DC
Server Form Factor1U ServerBearing Type2 Ball Bearing
CPU heatsink dimensions83*83*28 mmFan Connector4pin PWM
Fan SpeedPWM 2000-5000RPMHeatsink material Copper base +copper fin
Fan Airflow10.37CFM (MAX)Cooling TypeActive
Max Noise Level54.8 dBA (MAX)Cpu hole pitch75mm*75mm


Product Description

Lga 1151 cpu cooler
Active 1U Server Intel Lga 1151 Cpu Cooler 


This Lori lga 1151 cpu cooler is designed for Intel process, socket LGA 1151/1155/116 Sqaure, Copper skived fin heat sink up to TDP 95 W for 1U server solution. Our lga 1151 cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

1151 cpu cooler
       
Part1. Fine skiving process
The 1151 cpu cooler made by fine skiving technology, a complete piece of copper processing, no intermediate medium, to ensure good heat dissipation effect. And also using CNC processing: stable quality, high precision.
1151 cooler
       
Part 2. Using 7015 fan
Our 1151 cooler using 7015 fan, imported 1C original device, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.
Intel 1151 cooler
       
Part 3. Copper base heat conduction is fast

Copper Base zero distance contact, efficient heat dissipation. the smooth copper base is attached to the CPU, through the direct contact connection can make the heat conduction to the heat sink fin for heat dissipation.The heat generated by the copper bottom zero distance contact with the advantageous hand CPU first time 1 to conduct around




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