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Active Intel Cpu Lga 1151/1155/1156 Socket 2u Copper Server Heatsink

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Active Intel Cpu Lga 1151/1155/1156 Socket 2u Copper Server Heatsink
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Model No:
LGA115X-2U-P23
CPU Support:
Intel Cpu
CPU Socket:
LGA 1151/ 1155 /1156 Square Socket
Application:
2U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA115X-2U-P23TDP110 W
CPU Socket typeLGA 1151/ 1155/1156  CPU  socketVoltage Rating12V DC
Server Form Factor2U ServerBearing Type2 Ball Bearing
CPU heatsinkdimensions90*89*47 mmFan Connector4pin PWM
Fan SpeedPWM 1700-4300RPMHeatsink material Copper skvied fins
Fan Airflow32.49CFM (MAX)Cooling TypeActive
Max Noise Level34 dBA (MAX)ProcessSkiving, CNC machining


Product Description

Intel lga 1156 heatsink
Active Intel Cpu Lga 1151/1155/1156 Socket 2u Copper Server Heatsink


Lori lga 1156 heatsink is designed for intel CPU Server Processor, LGA 1151/1155/1156 cpu socket, The intel lga 1156 heatsink is copper skived fin het sink with Copper base double ball turbine temperature control fan up to TDP 110 W for 2U server solution. The cpu copper heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

Cpu copper heatsink
       
Part1. Fine skiving process
The cpu copper heatsink made by fine skiving process. It has a one-time molding, no loss type heat dissipation performance, good heat dissipation effect.
Lga 1156 heatsink
       
Part 2. Using 7020 fan
Our lga 1156 heatsink using 7020 fan, imported 1C original device, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.
2U Server heatsink
       
Part 3. Copper base heat conduction is fast

The 2u server heatsink's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around in the first time.The heat generated by the copper bottom zero distance contact with the advantageous hand CPU first time 1 to conduct around




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