Amd Sp3 Narrow LGA4094 2u Active Server Cpu Heat Sink For Desktop Computer of EPYC 7002 Series

Production Information

▋Product Specifications

Model No	AMD SP3 2U-C22	TDP	240W
CPU Socket type	AMD SP3 CPU Narrow socket (LGA4094)	Voltage Rating	12V DC
Server Form Factor	2U Server	Bearing Type	2 Ball Bearing
CPU Cooler dimensions	119.378.964.5 mm	Fan Connector	4pin PWM
Fan Speed	PWM 3000-6800RPM	Heatsink material	Aluminum fins+copper base + 4 heat pipes
Fan Airflow	37.74CFM (MAX)	Cooling Type	Active
Max Noise Level	54.34dBA (MAX)	Process	Stamping, Soldering, CNC machining
CPU	EPYC 7002 Series(AMD EPYC™ 7F72)

▋Product Description

AMD SP3 Narrow LGA4094 2U Active Server CPU Heat Sink For Desktop Computer of EPYC 7002 Series

Lori AMD SP3 Narrow 2U Active Server CPU Heat Sink is designed for AMD SP3 EPYC 7002 Series CPU Server Processor, AMD SP3 CPU Narrow socket (LGA4094), the server hear sink is aluminum fin stacked soldered on the copper base with 4 heat pipes up to TDP 225W for 2U server solution. The 2u cpu cooler height is 64.5 mm The AMD SP3 Cpu active heat sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part1. Server heat sink with 4 heat pipes

The server heat sink with 4 copper heat pipes have better heat conduction and thermal performace. The 4 heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the 2u heatsink fins more efficiently.

Part 2. Reflow soldering process

The cpu heat sink made by reflow soldering process makes it has better contact, stable thermal conductivity, high heat conversion rate, and efficient heat dissipation.

Part 3. Using 6025 fan

The sp3 2u cooler using 6025 fan, the fan was imported 1C original device, which is quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.

Part.4. aluminum fin heat sink module

The heat sink in computer made of pure copper base and aluminum fin heat sink module. the aluminum fin heat sink module in computer adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency, The heat sink fins on both sides of the sp3 cpu cooler can not only increase firmness, but also keep the same spacing between each fins, so that the airflow generated by the fan can pass through each fin evenly and smoothly, thus reducing noise and enhancing heat dissipation performance.

Part 3. electroplated chemical nickel

Inlaid copper base, aluminum fin, electroplated chemical nickel, uniform thickness, corrosion resistance, wear resistance, excellent thermal performance

Part 6.Pre-Printed Shin-Etsu 7762 Thermal Grease

Pre-Printed Shin-Etsu 7762 Thermal Grease of the 2u heatsink is high performance silicon.The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.