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Lori AMD SP3 2U Passive Server Cpu Cooler

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Lori AMD SP3 2U Passive Server Cpu Cooler
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Model No:
AMD SP3 2U-C21
CPU Support:
AMD SP3 CPU
CPU Socket:
SP3 Narrow socket
Application:
2U Server
Payment:
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoAMD SP3 1U-C21Fin pitch2.24mm
CPU Socket typeAMD SP3 CPU Narrow socketCPU TDP225W
Server Form Factor2U ServerVoltage Rating12V DC
CPU Cooler dimensions117*78.9*64 mmHeatsink materialAluminium fins+copper base + 4 heat pipes
Weight200gCooling TypePassive
Fin Thickness0.4mmProcessStamping, Soldering, CNC machining


Product Description

Amd sp3 cpu cooler
Lori AMD SP3 2U Passive Serve Cpu Cooler


Lori AMD SP3 2U Passive Serve Cpu Cooler is designed for AMD SP3 CPU Server Processor, AMD SP3 CPU Narrow socket, Aluminum fin soldered on the copper base with 4 heat pipes up to TDP 225W for 2U server solution. This AMD SP3 Cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

Sp3 2u cooler
       
Part 1. Cpu heatsink  with 4 heat pipes 
4 heat pipes are adopted for better heat conduction and thermal performace. The 4 heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.
Lori sp3 cooler
       
Part 2. Reflow soldering process
The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
Passive cpu cooling
       
Part 3. Pure copper heat conduction, aluminum fin heat sink module
Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency.
Amd sp3 cpu cooler
       
Part 4. Electroplated chemical nickel
Copper base and aluminum fin electroplated chemical nickel, uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance
sp3 2u cooler
       
Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease 
Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon.The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.
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