WELCOME TO LORI COOLING,LORI IS COOLING SOLUTION PROVIDER 

CPU Cooler

Home  > CPU Cooler  > AMD Cpu Cooler  > AMD SP3  > 

Lori AMD SP3 2U Passive Server Cpu Cooler

这里可以自定义设置
Lori AMD SP3 2U Passive Server Cpu Cooler
B站不支持收货地址
B站不支持库存规格
Model No:
AMD SP3 2U-C21
CPU Support:
AMD SP3 CPU
CPU Socket:
SP3 Narrow socket
Application:
2U Server
Payment:
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
参数暂无数据
多属性暂无数据
B站不支持优惠卷

Add success, do you want to check your shopping cart?

暂无分享
B站不支持产品保障
Production Information
bg


Product Specifications

Model NoAMD SP3 1U-C21Fin pitch2.24mm
CPU Socket typeAMD SP3 CPU Narrow socketCPU TDP225W
Server Form Factor2U ServerVoltage Rating12V DC
CPU Cooler dimensions117*78.9*64 mmHeatsink materialAluminium fins+copper base + 4 heat pipes
Weight490 gCooling TypePassive
Fin Thickness0.4mmProcessStamping, Soldering, CNC machining


Product Description

Sp3 cpu cooler
Lori AMD SP3 2U Passive Serve Cpu Cooler


Lori AMD SP3 2U Passive Serve Cpu Cooler is designed for AMD SP3 CPU Server Processor, AMD SP3 CPU Narrow socket, Aluminum fin soldered on the copper base with 4 heat pipes up to TDP 225W for 2U server solution. This AMD SP3 cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

Sp3 2u cooler
       
Part 1. The Sp3 cooler with 4 heat pipes 
4 heat pipes are adopted for better heat conduction and thermal performace. The 4 heat pipes of thg sp3 cooler cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.
Lori sp3 cooler
       
Part 2. Reflow soldering process
The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
Passive cpu cooling
       
Part 3. Pure copper heat conduction, aluminum fin heat sink module
Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency.
Sp3 cooler
       
Part 4. Electroplated chemical nickel
The sp3 cooler is made of copper base and electroplated chemical nickel aluminum fin, with uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance.
Lori cooler
       
Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease 

Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation. 

Looking for high perfermance sp3 cpu cooler, contact lori coolerLori cooler.

Product Message
Submit successfully
We will review as soon as possible
Product Message
社媒暂无评论
Chat Online
Chat Online
Leave Your Message inputting...
Sign in with: