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Lori AMD SP3 LGA4094 2U Passive Server Cpu Cooler for EPYC 7003 Series 1

Lori AMD SP3 LGA4094 2U Passive Server Cpu Cooler for EPYC 7003 Series 2

Lori AMD SP3 LGA4094 2U Passive Server Cpu Cooler for EPYC 7003 Series 3

Lori AMD SP3 LGA4094 2U Passive Server Cpu Cooler for EPYC 7003 Series 4

Lori AMD SP3 LGA4094 2U Passive Server Cpu Cooler for EPYC 7003 Series

Model No:

AMD SP3 2U-C21

CPU Support:

AMD EPYC 7003 Series CPU

CPU Socket:

SP3 Narrow socket (LGA4094)

Application:

2U Server

Payment:

T/T, L/C /Paypal

Delivery time :

3-15 days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	AMD SP3 1U-C21	Fin pitch	2.24mm
CPU Socket type	AMD SP3 CPU Narrow socket (LGA4094)	CPU TDP	260W
Server Form Factor	2U Server	Voltage Rating	12V DC
CPU Cooler dimensions	11778.964 mm	Heatsink material	Aluminium fins+copper base + 4 heat pipes
Weight	490 g	Cooling Type	Passive
Fin Thickness	0.4mm	Process	Stamping, Soldering, CNC machining
CPU	EPYC 7003 Series

▋Product Description

Lori AMD SP3 LGA4094 2U Passive Serve Cpu Cooler for EPYC 7003 Series

Lori AMD SP3 2U Passive Serve Cpu Cooler is designed for AMD SP3 EPYC 7003 series CPU Server Processor, AMD SP3 CPU Narrow socket (LGA4094), Aluminum fin soldered on the copper base with 4 heat pipes up to TDP 260W for 2U server solution. This AMD SP3 cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. The Sp3 cooler with 4 heat pipes

4 heat pipes are adopted for better heat conduction and thermal performace. The 4 heat pipes of thg sp3 cooler cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.

Part 2. Reflow soldering process

The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

Part 3. Pure copper heat conduction, aluminum fin heat sink module

Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency.

Part 4. Electroplated chemical nickel

The sp3 cooler is made of copper base and electroplated chemical nickel aluminum fin, with uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance.

Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.

Looking for high perfermance sp3 cpu cooler, contact lori coolerLori cooler.

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