Best Socket Lga 2011 Passive Cpu Cooler For Intel Xeon Processor 2u Server

LGA 2011

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Best Socket Lga 2011 Passive Cpu Cooler For Intel Xeon Processor 2U Server

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Model No:: LGA2011-A77

CPU Support:: Intel Xeon Processor Cpu

CPU Socket:: LGA 2011 Square Socket

Application:: 2U Server

Payment:: T/T ,L/C /Paypal

Delivery time :: 3-15days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA2011-2U-A77	Fin pitch	3.0 mm
CPU Socket type	LGA2011 Narrow	CPU TDP	110 W
Server Form Factor	2U Server	Voltage Rating	12V DC
CPU Cooler dimensions	90 x 90 x 64 mm	Heatsink material	Aluminium fins+Aluminum base + 3 heat pipes
Weight	420 g	Cooling Type	Passive
Fin Thickness	0.4 mm	Cpu hole pitch	80*80mm
CPU	Intel Xeon Processor(Intel Xeon Processor E5 v3/v4 and E7 v2Family)

▋Product Description

Best Socket Lga 2011 Passive Cpu Cooler For Intel Xeon Processor 2U Server

This Lori best lga 2011 cpu cooler is designed for Intel xeon process, socket LGA 2011 square, The best passive lga 2011 cpu cooler is aluminum stacked fin soldered on the aluminum base with 3 heat pipes for 2U server solution. Support 110 Watts CPU Power Heat Dissipation, The socket 2011 cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

best lga 2011 cpu cooler with 3 heat pipes

Part 1. 3 Heat pipes cpu cooler

Adopt 3 heat pipes, superconducting composite heat pipe, excellent heat conduction performance.

socket 2011 cpu cooler

Part 2. Reflow soldering process

Use reflow soldering process, reduce oxidation, stable performance, efficient heat dissipation

Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

The 7762 thermal grease imported from Japan is high performance silicon. The original imported 316 material from Japan guarantees the strong drawing force. Copper base and fin plating chemical nickel, with uniform thickness, corrosion resistance, wear resistance and excellent heat conduction performance.

Part 4. Base direct contact, efficient heat dissipation.

The base is attached to the CPU, through the direct contact connection can make the heat conduction to the heat sink fin for heat dissipation

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