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Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server 1

Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server 2

Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server 3

Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server 4

Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server 5

Intel Xeon Processors Lga 3647 Passive Square 2U Cpu Cooler For Server

Model No:

LGA3647-2U-B21

CPU Support:

Intel Xeon Processors Cpu

CPU Socket:

LGA 3647 square socket

Application:

2U Server

Payment:

T/T, L/C /Paypal

Delivery time :

3-15 days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA3647-2U-B21	Fin pitch	1.9 mm
CPU Socket type	LGA3647 CPU Square socket	CPU TDP	205 W
Server Form Factor	2U Server	Voltage Rating	12V DC
CPU Cooler dimensions	918864 mm	Heatsink material	Aluminium fins+copper base + 4 heat pipes
Weight	385.2 g	Cooling Type	Passive
Fin Thickness	0.4mm	Process	Stamping, Soldering, CNC machining
CPU Support	Intel Xeon Processors (Intel® Xeon® Platinum 8180 Processor and so on)

▋Product Description

Intel Xeon Processors Lga 3647 Passive Square 2u Cpu Cooler For Server

Lori Lga 3647 2u cpu cooler is designed for intel xeon processors lga 3647 cpu Server Processor, LGA 3647 square socket, the LGA3647 square cooler is aluminum fins soldered on the copper base with 4 heat pipes up to TDP 205W for 2U server solution. This lga 3647 cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. Lga 3647 cpu cooler with heatpipes

The Lga 3647 cpu cooler adopt 4 composite heat pipes, heat conduction ability is stronger, better excellent heat conduction and heat dissipation performance. The 4 heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.

Part 2. Reflow soldering process

Lga 3647 cpu cooler using reflow soldering process makes the heat pipe and base contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient. High precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the heat dissipation fin.

Part 3. Aluminum fin heat sink module

The Lga 3647 cooler adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency. The fins on both sides of the lga 3647 cooler can not only increase the firmness, but also keep the distance between each fin, so that the air flow can pass through each fin evenly and smoothly, and enhance the heat dissipation performance.

Part 4. Electroplated chemical nickel

1.The metal surface treated by this process is amorphous coating with excellent corrsion resistance.

2. Since the surface after catalytic treatment is amorphous, that is, it is in a basic plane state and has self-lubrication, therefore.Small friction coefficient, good non-adhesion, high wear resistance.

3. After electroless nickel plating, the hardness of metal surface can be increased by more than one time.

4. The bonding strength of the alloy layer and the metal base parts increases after electroless nickel plating. Generally, there is no peeling, no shedding and no bubble under the condition of 350-400mpa, and the bonding strength with aluminum can reach 102-241mpa.

Part 3. Copper base conducts heat rapidly

The Lga 3647 cooler's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around the first time.

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