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Intel Lga 3647 Passive Square 2U Cpu Cooler For Server

Intel Lga 3647 Passive Square 2U Cpu Cooler For Server
Model No:
CPU Support:
Intel Cpu
CPU Socket:
LGA 3647 square socket
2U Server
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
RoHS and REACH compliant

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Production Information

Product Specifications

Model NoLGA3647-2U-B21Fin pitch1.9 mm
CPU Socket typeLGA3647 CPU Square socketCPU TDP205 W
Server Form Factor2U ServerVoltage Rating12V DC
CPU Cooler dimensions91*88*64 mmHeatsink materialAluminium fins+copper base + 4 heat pipes
Weight385.2 gCooling TypePassive
Fin Thickness0.4mmProcessStamping, Soldering, CNC machining

Product Description

Lga 3647 cooler
Intel Lga 3647 Passive Square 2u Cpu Cooler For  Server

Lori Lga 3647 2u cpu cooler is designed for intel lga 3647 cpu Server Processor, LGA 3647 square socket, the LGA3647 square cooler is aluminum fins soldered on the copper base with 4 heat pipes up to TDP 205W for 2U server solution. This lga 3647 cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

Product Details

Lga 3647 cpu cooler
Part 1. Lga 3647 cpu cooler with heatpipes 
The Lga 3647 cpu cooler adopt 4 composite heat pipes, heat conduction ability is stronger, better excellent heat conduction and heat dissipation performance. The 4 heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.
Lga 3647 cpu cooler
Part 2. Reflow soldering process
Lga 3647 cpu cooler using reflow soldering process makes the heat pipe and base contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient.  High precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the heat dissipation fin.
Lga 3647 square cooler
Part 3. Aluminum fin heat sink module
The Lga 3647 cooler adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency. The fins on both sides of the lga 3647 cooler  can not only increase the firmness, but also keep the distance between each fin, so that the air flow can pass through each fin evenly and smoothly, and enhance the heat dissipation performance.
Intel Lga 3647 Cooler
Part 4. Electroplated chemical nickel

1.The metal surface treated by this process is amorphous coating with excellent corrsion resistance.

2. Since the surface after catalytic treatment is amorphous, that is, it is in a basic plane state and has self-lubrication, therefore.Small friction coefficient, good non-adhesion, high wear resistance.

3. After electroless nickel plating, the hardness of metal surface can be increased by more than one time.

4. The bonding strength of the alloy layer and the metal base parts increases after electroless nickel plating. Generally, there is no peeling, no shedding and no bubble under the condition of 350-400mpa, and the bonding strength with aluminum can reach 102-241mpa.

3647 cooler
Part 3. Copper base conducts heat rapidly
The Lga 3647 cooler's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around the first time.
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