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▋Product Specifications
Model No | LGA3647-1U-B11 | Fin pitch | 1.75 mm |
CPU Socket type | LGA3647 Square | CPU TDP | 165 W |
Server Form Factor | 1U Server | Voltage Rating | 12V DC |
CPU cooler dimensions | 91*88*25.5mm | Heatsink material | Aluminum fin + copper base + 2 heat pipes |
Weight | 300g | Cooling Type | Passive |
Fin Thickness | 0.3 mm | Process | Stamping, CNC machining |
CPU Support | Intel Xeon Scalable Processors ( Intel Xeon Platinum 8176 Processor, Intel Xeon Gold 6238R Processor and more) |
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