Intel Xeon W5 Series Processor LGA 4677 Socket Active CPU Cooler for 4U Workstation

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Intel Xeon W5 Series Processor LGA 4677 Socket Active CPU Cooler for 4U Workstation

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Model No:: LGA 4677-4U-D95

CPU Support:: Intel CPU

CPU Socket:: Intel LGA 4677 Socket

Application:: 4U Workstation

Payment:: T/T ,L/C /Paypal

Delivery time :: 3-15days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

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▋Product Specifications

Model No	LGA 4677-4U-D95	TDP	400 W
CPU Socket type	Intel LGA 4677 Socket	Voltage Rating	12V
Server Form Factor	4U Workstation	Bearing Type	Double Ball Fan
CPU Cooler dimensions	118mm100mm125.0mm	Fan Interface	4pin PWM
Fan Speed	PWM 2000-5500RPM	Heatsink material	Aluminum fins+Copper base + 6 heat pipes
Fan Airflow	125.00CFM (MAX)	Cooling Type	Active
Max Noise Level	52.00dBA (MAX)	Process	Stamping, Soldering, CNC machining
CPU Support	Intel Xeon W5 Series Processor (Intel Xeon w5-2545/3525/2555X and more)

▋Product Description

Intel Xeon W5 Series Processor LGA 4677 Socket Active CPU Cooler for 4U Workstation

Lori LGA4677-4U-D95 CPU cooler is designed for Intel xeon w5 series processors, LGA 4677 Socket. Aluminum fins with 6 heat pipes embedded and soldered on the copper base up to TDP 400W for 4U server solution. The LGA4677-4U-D95 active CPU cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance

Product Details

part.1 Large Copper Base

The large copper base design allows for more efficient heat transfer from the CPU to the base, heat pipes and fins.

part.2 Dual Tower Fin Structure

The large stamped and folded fins of the dual-tower make the fins tighter and provide more efficient heat transfer than single-tower fins.

part.3 Pre-coated High-performance Thermal Grease

Pre-coated thermal grease at the base of the heat sink simplifies the installation steps, making it easier and more convenient to install the heat sink. The high-performance thermal grease has lower thermal resistance and greater stability, ensuring more stable performance of the heat sink.

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