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Intel Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71

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Intel Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71
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Model No:
LGA 4189-D71
CPU Support:
Intel® Ice Lake and Cooper Lake Server Processor
CPU Socket:
FC LGA 4189 socket
Application:
1U Server
Payment:
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA 4189-D71CPU TDP200W
CPU Socket typeFC LGA 4189 socketVoltage Rating12V DC
Server Form Factor1U ServerHeatsink materialAluminium stacked fins+copper base + 3 heat pipes
CPU Cooler dimensions113*78*25.3 mmCooling TypePassive
Weight200gProcessStamping, Soldering, CNC machining
Fin Thickness0.3mmCPU TDP200W
Fin pitch1.5mm


Product Description

Lga4189 heatsink
Intel LGA4189 Passive Cpu Heatsink Cooer with Heatpipes for 1U Server D71


Lori D71 LGA4189 cpu cooler is designed for 1u passive cpu heatsink for Intel® Ice Lake and Cooper Lake Server Processor, FC LGA 4189 socket, Aluminum stacked fin soldered on the copper base with 3 heat pipes up to TDP 200W for 1U server solution. The LGA4189 heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

lga4189 heatsink server
       
Part1. LGA4189 Heatsink with 3 Heatpipes
The passive cpu cooler with three Copper heat pipes are adopted for better heat conduction. The three copper heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the server heatsinks more efficiently. The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
lga4189 cooler
       
Part 2. Pre-Printed Shin-Etsu 7762 Thermal Grease
Pre-Printed Shin-Etsu 7762 Thermal Grease in the lga4189 cooler is high performance silicon. Aluminum fin heat dissipation module, adopt pure aluminum material joined heat dissipation group design, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency.
Heatsink 1u
       
Part 3. Electroplating chemical nickel
The LGA4189 heatsink fin is processed by electroplating chemical nickel, Nickel plating process increases beauty,oxidation resistance,and excellent heat conduction performance. The base conducts heat rapidly, and the base is zero distance from the CPU, so that the heat can be quickly transmitted to the fin for heat dissipation. Learm more server heatsinks, contact us.
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