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3th Intel Xeon Scalable Processors Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71 1

3th Intel Xeon Scalable Processors Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71 2

3th Intel Xeon Scalable Processors Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71 3

3th Intel Xeon Scalable Processors Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71 4

3th Intel Xeon Scalable Processors Lga4189 Passive Cpu Heatsink Cooer With Heatpipes For 1u Server D71

Model No:

LGA 4189-D71

CPU Support:

3th Intel Xeon Scalable Processors Ice Lake and Cooper Lake Server Processor

CPU Socket:

FC LGA 4189 socket

Application:

1U Server

Payment:

T/T, L/C /Paypal

Delivery time :

3-15 days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA 4189-D71	CPU TDP	185 W
CPU Socket type	FC LGA 4189 socket	Voltage Rating	12V DC
Server Form Factor	1U Server	Heatsink material	Aluminum fins+ Copper base + 4 heat pipes
CPU Cooler dimensions	1137825.3 mm	Cooling Type	Passive
Weight	420 g	Process	Stamping, Soldering, CNC machining
Fin Thickness	0.3mm	Fin pitch	1.5mm
CPU Support	3th Intel Xeon Scalable Processors ( Intel® Xeon® Platinum 8354H Processor and more)

▋Product Description

3th Intel Xeon Scalable Processors LGA4189 Passive Cpu Heatsink Cooer with Heatpipes for 1U Server D71

Lori D71 LGA4189 cpu cooler is designed for 1u passive cpu heatsink for 3th Intel xeon scalable processors Ice Lake and Cooper Lake Server Processor, FC LGA 4189 socket, Aluminum stacked fin soldered on the copper base with 3 heat pipes up to TDP 185W for 1U server solution. The LGA4189 heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part1. LGA4189 Heatsink with 3 Heatpipes

The passive cpu cooler with three Copper heat pipes are adopted for better heat conduction. The three copper heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the server heatsinks more efficiently. The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

Part 2. Pre-Printed Shin-Etsu 7762 Thermal Grease

Pre-Printed Shin-Etsu 7762 Thermal Grease in the lga4189 cooler is high performance silicon. Aluminum fin heat dissipation module, adopt pure aluminum material joined heat dissipation group design, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency.

Part 3. Electroplating chemical nickel

The LGA4189 heatsink fin is processed by electroplating chemical nickel, Nickel plating process increases beauty，oxidation resistance，and excellent heat conduction performance. The base conducts heat rapidly, and the base is zero distance from the CPU, so that the heat can be quickly transmitted to the fin for heat dissipation. Learm more server heatsinks, contact us.

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