Intel Xeon Processors Tower Lga 3647 Active 4u Cooler Cooling With Two Fans

Production Information

▋Product Specifications

Model No	LGA3647-A35	TDP	300W
CPU Socket type	Lga 3647 cpu socket	Voltage Rating	12V DC
Server Form Factor	4U Server	Bearing Type	2 Ball Bearing
CPU Cooler dimensions	125 x 102 x 155mm	Fan Connector	4pin PWM
Fan Speed	PWM 1000-2200RPM	Heatsink material	Aluminum fins+ Copper base + 5 heat pipes
Fan Airflow	86CFM (MAX)	Cooling Type	Active
Max Noise Level	32.0dBA (MAX)	Process	Stamping, Soldering, CNC machining
CPU Support	Intel Xeon Processors

▋Product Description

Intel Xeon Processors Tower Lga 3647 Active 4u Cooler Cooling With Two Fans

This intel tower cooler is designed for Intel xeon processors 4U server processor, tower and destop computer, lga 3647 cpu square socket, aluminum fins with 5 heat pipes embedded and soldered on the copper base up to TDP 300W for 4U server solution. The Intel lga 3647 cooling has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. 5 Heat pipe cpu cooler

The intel tower lga 3647 cooler use 5 heat pipes, so it has better heat conduction ability, better excellent heat conduction and heat dissipation performance，The 5 high efficiency copper heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to transfer to the lga3647 cooler fins.

Part 2.Pure copper heat conduction and 5 heat pipes heat absorption

Pure copper heat conduction and 5 heat pipes heat absorption, the fins on both sides of the lga 3647 cooler can not only increase firmness, but also keep the same spacing between each fin, so that the airflow generated by the fan can pass through each fin evenly and smoothly, so as to reduce noise and enhance heat dissipation performance.

Part 3. Using the 9225 fan

The active 4u cpu cooler using the 12025 two ball bearing fan, which is imported 1C original device and has the advantage of durable quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. The unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.

Part 4. Reflow soldering process

The lga 3647 narrow cooler adopt reflow soldering process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the cpu cooler fin. Aluminum base conducts heat rapidly, Aluminum base zero distance contact is conducive to the heat from the CPU to conduct around the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.

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