Lori 4th&5th Gen lntel Xeon Gold Fclga4677 Socket 1U Cpu Heat Sink D71 TDP 205W

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Lori 4th&5th Gen lntel Xeon Gold Fclga4677 Socket 1U Cpu Heat Sink D71 TDP 205W

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Model No:: LGA 4677-D71

CPU Support:: 5th Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Bronze 3408U Processor

CPU Socket:: FCLGA 4677 Socket

Application:: 1U Server

Payment:: T/T ,L/C /Paypal

Delivery time :: 3-15days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA 4677-D71	CPU TDP	205W
CPU Socket type	FC LGA 4677 socket	Voltage Rating	12V DC
Server Form Factor	1U Server	Heatsink material	Aluminium fins + copper base + 4 heat pipes
CPU Cooler dimensions	1137825.3 mm	Cooling Type	Passive
Weight	200g	Process	Stamping, Soldering, CNC machining
Fin Thickness	0.3mm	CPU	Intel® Xeon® Bronze/Gold Processor /5th Gen Intel® Xeon® Scalable Processor or more
Fin pitch	1.5mm	Heat pipe	4 heat pipes

▋Product Description

Lori 4th&5th Gen lntel Xeon Gold Fclga4677 Socket 1U Cpu Heat Sink D71 TDP 205W

Lori D71 LGA4677 cpu heat sink is designed for 1U cooler for 4th&5th Gen Intel Xeon Gold and Cooper Lake Server Processor, FC LGA 4189 socket, Aluminum heat sink fin soldered on the copper base with 4 heat pipes up to TDP 205W for 1U server solution. The LGA4189 heat sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part1. LGA4677 lntel Xeon Cpu Heat Sink with 4 Heatpipes

Three Copper heat pipes are adopted for better heat conduction. The three copper heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently. The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

Part 2. Pre-Printed Shin-Etsu 7762 Thermal Grease

Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. Aluminum fin heat dissipation module, adopt pure aluminum material joined heat dissipation group design, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency.

Part 3. Electroplating chemical nickel

The LGA41677 1U heat sink is processed by electroplating chemical nickel, Nickel plating process increases beauty，oxidation resistance，and excellent heat conduction performance. The base conducts heat rapidly, and the base is zero distance from the CPU, so that the heat can be quickly transmitted to the fin for heat dissipation.

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