Lori 4u Server Active Lga1700 Heatpipe Cpu Cooler

Production Information

▋Product Specifications

Model No	LGA1700-A79	TDP	210W
CPU Socket type	LGA1700 Square	Voltage Rating	12V DC
Server Form Factor	4U Server	Bearing Type	2 Ball Bearing
CPU Cooler dimensions	105 x 92.5 x 125.8 mm	Fan Connector	4pin PWM
Fan Speed	PWM 1300-3800RPM	Heatsink material	Aluminum fins+ Aluminum base + 5 heat pipes
Fan Airflow	61.46CFM (MAX)	Cooling Type	Active
Max Noise Level	40.0dBA (MAX)	Cpu holes pitch	78*78mm

▋Product Description

4U server cpu cooler with 5 nickel plated heat pipe,durable bearing ball and temperature control fan.

This Lori A79 Lga1700 cooler is designed for Intel 4U Server Processor and destop computer, socket LGA 1700 square, Aluminum Fins with 5 heat pipes embedded and soldered on the aluminum base up to TDP 210W for 4U server solution. The Intel LGA 1700 4u server cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. 5 Heat pipes

The 4u server cpu cooler use 5 heat pipes, which has better heat conduction ability, better excellent heat conduction and heat dissipation performance，The 5 high efficiency heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to transfer to the 4u lga1700 cooler fins.

Part 2.Nickel plating technology for heat pipe

The lga1700 heat pipe cpu cooler adopts nickel plating technology, The design of 5 heat pipes, through the nickel plating surface treatment, increases the contact between magnesium light and anti-oxidation heat pipe, effectively improve heat conduction efficiency of the heat pipes.

Part 3. Using the 9225 fan

The 4U server cpu cooler using the 9225 two ball bearing fan, which is imported 1C original device and has the advantage of durable quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. The unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.

Part 4. Reflow soldering process

The 4U heatpipe cpu cooler adopt reflow soldering process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the 4U cpu cooler fin. Aluminum base conducts heat rapidly, Aluminum base zero distance contact is conducive to the heat from the CPU to conduct around the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.

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CPU Cooler

Lori 4U Server Active Lga1700 Heatpipe Cpu Cooler