Lori Cooler Releases a Series of Heat Sinks for Cooling High Power Cpus, Gpus, FPGAs, and AI Processors.

Lori cooler has released a series of heat sinks for cooling high power Cpus, Gpus, FPGAs, and AI processors.

The cooling solution series includes active heat sinks with integrated blowers and passive heat sinks that take advantage of available air flow to provide thermal management.

Active heat sinks dual FLOW and quad FLOW are designed for medium to high component density PCBS, including 1U and 2U boards.

Depending on the sink, aluminum or copper heat sink fins are installed at the base and a blower is installed at the top. Fast-moving, high-flow air helps maximize the thermal performance of crowded circuit boards and sealed enclosures, while passively cooled airflow is insufficient.

The passive or fanless cooling solution in the Lori’s cooling solution series is the straight fin heat sink. Depending on thermal performance and weight requirements, they are made of aluminum or nickel-plated copper. They are suitable for systems that open the air flow from front to back. Aluminum heat sink fins reduce overall weight, while copper heat sink fins dissipate heat more efficiently for better thermal performance.

The Lori cooling solution heat sink fits the standard Intel LGA 2011 Socket (Socket R) square and LGA 2066 socket (Socket R4) commonly used in high-end cloud and edge server applications. The optional back plate can be used for applications other than the Intel LGA 2011 socket.

The heat sink can be secured with PEM screws and springs, in close contact with the thermal components for optimal heat dissipation. DualFLOW and quadFLOW cooling units can use a vapor chamber base instead of an aluminum or copper heat sink base.

For more details on the heat sinks for cooling high power Cpus, Gpus, FPGAs, and AI processors. Please contact Lori.