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Lori Intel Lga 1151 2u Active Cpu Heatsink

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Lori Intel Lga 1151 2u Active Cpu Heatsink
LGA115X-2U-P24
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Model No:
LGA115X-2U-P24
CPU Support:
Intel CPU
CPU Socket:
LGA1151/1155/1156 Square Intel Socket
Application:
2U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA115X-2U-P24TDP110 W
CPU Socket typeLGA1151/1155/1156 Square Intel Socket Voltage Rating12V DC
Server Form Factor2U ServerBearing Type2 Ball Bearing
CPU heatsink dimensions90*90*48 mmFan Connector4pin PWM
Fan SpeedPWM 1700-4300RPMHeatsink material Copper skvied fins
Fan Airflow32.49CFM (MAX)Cooling TypeActive
Max Noise Level34 dBA (MAX)ProcessSkiving, CNC machining


Product Description

Lga 1151 heatsink
Lori  Intel Lga 1151/1155/1156 2U Active Cpu Heatsink


This Lori Lga 1151 heatsink is designed for Intel process, socket LGA 1151/1155/116 Sqaure, Copper skived fin heat sink up to TDP 110W for 1U server solution. Our Lga 1151 heatsinks have been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

Lga 1151 2u heatsink
       
Part1. Fine skiving process
The lga 1151 2u heatsink made by fine skiving technology, a complete piece of copper processing, no intermediate medium, to ensure good heat dissipation effect. And also using CNC processing: stable quality, high precision.
1151 heatsink
       
Part 2. Using 7020 fan
Our 1151 heatsink using 7020 fan, imported 1C original device, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.
Lga 1151 2u cpu heatsink
       
Part 3. Copper base heat conduction is fast

Copper Base zero distance contact, efficient heat dissipation. the smooth copper base is attached to the CPU, through the direct contact connection can make the heat conduction to the heat sink fin for heat dissipation.The heat generated by the copper bottom zero distance contact with the advantageous hand CPU first time 1 to conduct around




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