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|Model No||LGA1700-N11-A||Fin pitch||1.36 mm|
|CPU Socket type||LGA1700 CPU Square socket||CPU TDP||180 W|
|Server Form Factor||1U Server||Voltage Rating||12V DC|
|CPU Cooler dimensions||90*90*25.5 mm||Heatsink material||Aluminium fins+Vapor Chamber|
|Cpu hole pitch||78mm*78mm||Cooling Type||Passive|
|Fin Thickness||0.25mm||Process||Stamping, Soldering, CNC machining|
1. The upper and lower copper sheets are made of oxygen-free copper, and the capillary structure is made of copper powder sintering process
2. The temperature difference measured at any two points of the plate can be less than 5℃, and the heat conduction effect is more uniform than that of the heat conduit.
3. It has the advantages of low expansion thermal resistance, uniform heat flux, rapid heat diffusion and light weight.