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Lori Passive 12th/13th/14th Gen Intel Core i9 Processors Lga 1700 1U Server Vapor Chamber Cpu Cooler
5.0
Model No:
LGA1700-N11-A
CPU Support:
12th/13th/14th Gen Intel Core i9 Processors Cpu
CPU Socket:
Socket LGA1700 square
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Production Information
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▋Product Specifications
| Model No | LGA1700-N11-A | Fin pitch | 1.36 mm |
| CPU Socket type | LGA1700 CPU Square socket | CPU TDP | 130 W |
| Server Form Factor | 1U Server | Voltage Rating | 12V DC |
| CPU Cooler dimensions | 90*90*25.5 mm | Heatsink material | Aluminium fins+Vapor Chamber |
| Cpu hole pitch | 78mm*78mm | Cooling Type | Passive |
| Fin Thickness | 0.25mm | Process | Stamping, Soldering, CNC machining |
| CPU | 12th/13th/14th Gen Intel Core i9 Processors(Intel Core i9-12900KS/13900KS/14900KS Processor) | ||
▋Product Description
Passive 12th/13th/14th Gen Intel Core i9 Processors Lga 1700 1U Server Vapor Chamber Cpu Cooler
The Intel lga 1700 cooler is designed for 12th/13th/14th gen Intel core i9 lga 1700 Cpu Server Processor, LGA 1700 square socket, the intel 1700 cooler is aluminum fins soldered on the vapor chamber up to TDP 130W for 1U server solution. This lga 1700 cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.
▋Product Details
Part 1. Fine zipper fin technology
High precision tight joint, fine workmanship, so that the distance of each fin is consistent, the air flow evenly and smoothly through each fin, enhance the heat dissipation performance, with one-time molding, non-loss type heat dissipation performance, good heat dissipation effect.
Part 2. 25mm thin height
The height of the Intel 1700 cooler is only 25mm structure design, good cooling performance, suitable for compact space and small size CPU heat dissipation.
Part 3. Using reflow soldering process
This intel lga 1700 cpu cooler adopts Better contact, stable thermal conductivity, high thermal conversion rate, efficient heat dissipation. The heat dissipation fin and base adopt reflow soldering process, high precision tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to heat dissipation fin.
Part 4. Using vapor chamber
1. The upper and lower copper sheets are made of oxygen-free copper, and the capillary structure is made of copper powder sintering process
2. The temperature difference measured at any two points of the plate can be less than 5℃, and the heat conduction effect is more uniform than that of the heat conduit.
3. It has the advantages of low expansion thermal resistance, uniform heat flux, rapid heat diffusion and light weight.
Part 3. Copper base conducts heat rapidly
The intel lga 1700 cooler's copper base zero distance contact is conducive to the heat generated by the CPU to conduct around the first time. Attach to CPU heating core, absorb and conduct every minute of heat in time
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E-mail: sales@lori-cn.com
Mobile phone: +86 17775668621
Mobile phone: +86 17775668621
Address: No. 6, Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, China
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