WELCOME TO LORI COOLING,LORI IS COOLING SOLUTION PROVIDER 

CPU Cooler

Home  > CPU Cooler  > Intel Cpu Coolers  > LGA 4189  > 

Passive 2U Cpu Cooler for Intel LGA4189 Narrow Socket D81

这里可以自定义设置
Passive 2U Cpu Cooler for Intel LGA4189 Narrow Socket D81
B站不支持收货地址
B站不支持库存规格
Model No:
LGA 4189-D81
CPU Support:
Intel Cpu
CPU Socket:
FC LGA 4189 socket Narrow
Application:
2U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
参数暂无数据
多属性暂无数据
B站不支持优惠卷

Add success, do you want to check your shopping cart?

暂无分享
B站不支持产品保障
Production Information
bg


Product Specifications

Model NoLGA 4189-D81Fin pitch1.65mm
CPU Socket typeFC LGA 4189 socketCPU TDP200W
Server Form Factor2U ServerVoltage Rating12V DC
CPU Cooler dimensions113*78*64.3 mmHeatsink materialAluminium fins+copper base + 5 heat pipes
Weight510gCooling TypePassive
Fin Thickness0.35mmProcessStamping, Soldering, CNC machining


Product Description

2u passive heatsink
Passive 2U Cpu Cooler for Intel LGA4189 Narrow Socket D81 


Lori D81 LGA4189 cooler is designed for 2U Cooler for Intel® Ice Lake and Cooper Lake Server Processor, FC LGA 4189 CPU socket, Aluminum fins soldered on the copper base with 5 heat pipes up to TDP 250 W for 2U server solution. Cooper base dimensions is 72*54 mm, Lori Passive cpu coolers have been fully tested and validated by Lori to ensure the best quality and cooling performance.



Product Details

2u cpu cooler with heat pipe
       
part.1
Five heat pipes are adopted for better heat conduction. The 5 heat pipes with oxidation resistance cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heatsink fins more efficiently.
passive cpu coolers
       
part.2
The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient.
Lga 4189 cooler
       
part.3
2U cpu cooler thermal module, adopt design of interlocking heat dissipation group for pure aluminum material, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency. The large area of aluminum heat sink fin can not only increase firmness, but also keep the same spacing of each fin, so that the air flow can pass through each fin evenly and smoothly, and enhance heat dissipation performance.
LGA 4189 passive cpu coolers
       
part.4
The LGA 4189 passive cpu coolers are nickel plated and 0.35mm thick Nickel plating process increases beauty,oxidation resistance,and excellent heat conduction performance. Multiple layers of airflow penetration are designed to minimize airflow loss. The zero-distance CPU of the base facilitates the heat generated by the CPU to be transmitted around in the first time, Attach to CPU heating core, absorb and conduct every minute of heat in time
Product Message
Submit successfully
We will review as soon as possible
Product Message
社媒暂无评论
Chat Online
Chat Online
Chat Online inputting...
Sign in with: