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Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81 1

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81 2

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81 3

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81 4

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81 5

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81

Model No:

LGA 4189-D81

CPU Support:

Intel Xeon Platinum 8352V Processor Cpu

CPU Socket:

FC LGA 4189 socket Narrow

Application:

2U Server

Payment:

T/T ,L/C /Paypal

Delivery time :

3-15days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA 4189-D81	Fin pitch	1.65mm
CPU Socket type	FC LGA 4189 socket	CPU TDP	270 W
Server Form Factor	2U Server	Voltage Rating	12V DC
CPU Cooler dimensions	1137864.3 mm	Heatsink material	Aluminium fins+copper base + 5 heat pipes
Weight	510g	Cooling Type	Passive
Fin Thickness	0.35mm	Process	Stamping, Soldering, CNC machining
CPU Support	Intel Xeon Platinum 8352V Processor

▋Product Description

Passive 2U Cpu Cooler for Intel Xeon Platinum 8352V Processor LGA4189 Narrow Socket D81

Lori D81 LGA4189 cooler is designed for 2U Cooler for Intel Xeon Platinum 8352V Processor Ice Lake and Cooper Lake Server Processor, FC LGA 4189 CPU socket, Aluminum fins soldered on the copper base with 5 heat pipes up to TDP 270 W for 2U server solution. Cooper base dimensions is 72*54 mm, Lori Passive cpu coolers have been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

part.1

Five heat pipes are adopted for better heat conduction. The 5 heat pipes with oxidation resistance cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heatsink fins more efficiently.

part.2

The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient.

part.3

2U cpu cooler thermal module, adopt design of interlocking heat dissipation group for pure aluminum material, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency. The large area of aluminum heat sink fin can not only increase firmness, but also keep the same spacing of each fin, so that the air flow can pass through each fin evenly and smoothly, and enhance heat dissipation performance.

part.4

The LGA 4189 passive cpu coolers are nickel plated and 0.35mm thick Nickel plating process increases beauty，oxidation resistance，and excellent heat conduction performance. Multiple layers of airflow penetration are designed to minimize airflow loss. The zero-distance CPU of the base facilitates the heat generated by the CPU to be transmitted around in the first time, Attach to CPU heating core, absorb and conduct every minute of heat in time

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