We will review as soon as possible
|Model No||AMD SP3 1U-C24||Fin pitch||2.24mm|
|CPU Socket type||AMD SP3 CPU Narrow socket||CPU TDP||300 W|
|Server Form Factor||2U Server||Voltage Rating||12V DC|
|CPU Cooler dimensions||115*80*64 mm||Heatsink material||Aluminium fins + 5 heat pipes|
|Weight||490 g||Cooling Type||Passive|
|Fin Thickness||0.4mm||Process||Stamping, Soldering, CNC machining|
Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.
Looking for high perfermance sp3 cpu passive heatsink, contact lori coolerLori cooler.
Copyright © 2022 Shenzhen Lori Technology Co.,Ltd. | All Rights Reserved