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AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer 1

AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer 2

AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer 3

AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer 4

AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer

Model No:

AMD SP3 2U-C24

CPU Support:

AMD SP3 CPU

CPU Socket:

SP3 TR4 Narrow socket

Application:

2U Server

Payment:

T/T ,L/C /Paypal

Delivery time :

3-15days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

Inquiry

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Production Information

▋Product Specifications

Model No	AMD SP3 1U-C24	Fin pitch	2.24mm
CPU Socket type	AMD SP3 CPU Narrow socket	CPU TDP	300 W
Server Form Factor	2U Server	Voltage Rating	12V DC
CPU Cooler dimensions	1158064 mm	Heatsink material	Aluminium fins + 5 heat pipes
Weight	490 g	Cooling Type	Passive
Fin Thickness	0.4mm	Process	Stamping, Soldering, CNC machining

▋Product Description

AMD SP3 TR4 Cpu Passive Heatsink 2U With 5 Heat Pipes For AMD Desktop Computer

The AMD SP3 2U-C24 is designed for amd sp3 Tr4 cpu server processor, amd sp3 narrow socket, Aluminum fin soldered on the copper base with 5 heat pipes up to TDP 300 W for 2u server solution. This AMD sp3 tr4 heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. The Sp3 tr4 heatsink with 5 heat pipes

5 heat pipes are adopted for better heat conduction and thermal performace. The 5 heat pipes of thg amd sp3 heatsink cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the tr4 heatsink fins more efficiently.

Part 2. Reflow soldering process

The reflow soldering process of the amd sp3 heatsink makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

Part 3. Pure copper heat conduction, aluminum fin heat sink module

The heatsink 2u with Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency.

Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.

Looking for high perfermance sp3 cpu passive heatsink, contact lori coolerLori cooler.

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