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Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647

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Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647
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Model No:
LGA3647-2U-B22
CPU Support:
Intel Cpu
CPU Socket:
Lga 3647
Application:
2U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA3647-2U-B22TDP205W
CPU Socket typeLga 3647 cpu square socketVoltage Rating12V DC
Server Form Factor2U ServerBearing Type2 Ball Bearing
CPU heat sink dimensions91 x 88 x 45 mmFan Connector4pin PWM
Fan SpeedPWM 2100-6800RPMHeat sink materialAluminum fins+ Copper base + 4 heat pipes
Fan Airflow34.50CFM (MAX)Cooling TypeActive
Max Noise Level52.0dBA (MAX)ProcessStamping, Soldering, CNC machining


Product Description

Intel heat sink lga 3647
Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647


This intel cpu active heat sink is designed for Intel 2U server processor, tower and destop computer, lga 3647 cpu square socket, aluminum fins with 4 heat pipes embedded and soldered on the copper base up to TDP 205W for 2u server active solution. The intel cpu 2u server active square heat sink for lag 3647 has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

Active heat sink
       
Part 1. 4 Heat pipe active heat sink
The 2u active lga 3647 square heat sink use 4 heat pipes,  so it has better heat conduction ability, better excellent heat conduction and heat dissipation performance,The 4 high efficiency copper heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to transfer to the lga 3647 low profile cooler fins.


Heat sink lga 3647
       
Part 2.Pure copper heat conduction and 4 heat pipes heat absorption
Pure copper heat conduction and 4 heat pipes heat absorption, the fins on both sides of the heat sink lga 3647 can not only increase firmness, but also keep the same spacing between each fin, so that the airflow generated by the fan can pass through each fin evenly and smoothly, so as to reduce noise and enhance heat dissipation performance.
Server heat sink
       
Part 3. Using the 6025 fan
The 2U server active heat sink using the 6025 two ball bearing fan, which is  imported 1C original device and has the advantage of durable quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. The unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.
Intel cpu heat sink
       
Part 4. Reflow soldering process
The intel cpu heat sink lga3647 adopt reflow soldering process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the cpu cooler fin. Copper base conducts heat rapidly, Copper base zero distance contact is conducive to the heat from the CPU to conduct around the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.
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