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Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647 1

Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647 2

Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647 3

Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647

Model No:

LGA3647-2U-B22

CPU Support:

Intel Cpu

CPU Socket:

Lga 3647

Application:

2U Server

Payment:

T/T ,L/C /Paypal

Delivery time :

3-15days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

Inquiry

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Production Information

▋Product Specifications

Model No	LGA3647-2U-B22	TDP	205W
CPU Socket type	Lga 3647 cpu square socket	Voltage Rating	12V DC
Server Form Factor	2U Server	Bearing Type	2 Ball Bearing
CPU heat sink dimensions	91 x 88 x 45 mm	Fan Connector	4pin PWM
Fan Speed	PWM 2100-6800RPM	Heat sink material	Aluminum fins+ Copper base + 4 heat pipes
Fan Airflow	34.50CFM (MAX)	Cooling Type	Active
Max Noise Level	52.0dBA (MAX)	Process	Stamping, Soldering, CNC machining

▋Product Description

Lori B22 Intel Cpu 2U Server Active Square Heat Sink lga 3647

This intel cpu active heat sink is designed for Intel 2U server processor, tower and destop computer, lga 3647 cpu square socket, aluminum fins with 4 heat pipes embedded and soldered on the copper base up to TDP 205W for 2u server active solution. The intel cpu 2u server active square heat sink for lag 3647 has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. 4 Heat pipe active heat sink

The 2u active lga 3647 square heat sink use 4 heat pipes, so it has better heat conduction ability, better excellent heat conduction and heat dissipation performance，The 4 high efficiency copper heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to transfer to the lga 3647 low profile cooler fins.

Part 2.Pure copper heat conduction and 4 heat pipes heat absorption

Pure copper heat conduction and 4 heat pipes heat absorption, the fins on both sides of the heat sink lga 3647 can not only increase firmness, but also keep the same spacing between each fin, so that the airflow generated by the fan can pass through each fin evenly and smoothly, so as to reduce noise and enhance heat dissipation performance.

Part 3. Using the 6025 fan

The 2U server active heat sink using the 6025 two ball bearing fan, which is imported 1C original device and has the advantage of durable quiet, stable, strong wind, large air volume, fast and efficient heat dissipation. The unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.

Part 4. Reflow soldering process

The intel cpu heat sink lga3647 adopt reflow soldering process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the cpu cooler fin. Copper base conducts heat rapidly, Copper base zero distance contact is conducive to the heat from the CPU to conduct around the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.

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