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Best Standard 1U Passive Cooling Cpu Heatsink For Lga 3647 Socket
5.0
Model No:
LGA3647-1U-B11
CPU Support:
Intel Cpu
CPU Socket:
Socket LGA3647 Square
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Production Information
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▋Product Specifications
| Model No | LGA3647-1U-B11 | Fin pitch | 1.75 mm |
| CPU Socket type | LGA3647 Square | CPU TDP | 165 W |
| Server Form Factor | 1U Server | Voltage Rating | 12V DC |
| CPU Heatsink dimensions | 91*88*25.5mm | Heatsink material | Aluminum fin + copper base + 2 heat pipes |
| Weight | 300g | Cooling Type | Passive |
| Fin Thickness | 0.3 mm | Process | Stamping, CNC machining |
▋Product Description
Best Standard 1U Passive Cooling Cpu Heatsink For Lga 3647 Socket
This LGA3647-1U-B11 is best 1u passive cooling heatsink is designed for intel cpu 1u server lga 3647 socket, The lga 3647 1u passive heatsinks made by Aluminum stamping process, support 165W cpu power heat dissipation for 1u server solution. The standard 1u passive cooling cpu heatsink for lga 3647 socket for 1u server has been fully tested and validated by Lori to ensure the best quality and cooling performance.
▋Product Details
part.1
The 1u passive heatsink produce by aluminum stamping process, and passive cooling heatsink's height is 25.5mm with good cooling performance, suitable for compact space and small size CPU heat dissipation
part.2
The 1u passive cooling cpu heatsink for lga3647 with copper base direct contact, high efficient heat dissipation. The copper base is in contact with the cpu at a zero distance, which facilitates the heat generated by the cpu to be transmitted around in the first time.
part.3
The 7762 thermal grease of the 1u passive heatsink for lga 3647 imported from Japan is high performance silicon. The original imported 316 material from Japan guarantees the strong drawing force.
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E-mail: sales@lori-cn.com
Mobile phone: +86 17775668621
Mobile phone: +86 17775668621
Address: No. 6, Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, China
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