H100 Gpu Cold Plate

This NVIDIA H100 GPU Cold Plate is specifically designed for the NVIDIA H100 SXM computing GPU. It is made of high-purity copper material of CU1200 and is manufactured using solid-state diffusion welding technology. It is intended for AI supercomputing servers, large model training, and high-performance computing clusters, providing a highly reliable liquid cooling solution. The main body of the cold plate is made of high thermal conductivity CU1200 copper material. The internal microchannels are achieved through solid-state diffusion welding for metallurgical integration, without solder gaps. The flow channels have excellent pressure-bearing performance, reducing the risk of liquid leakage from the source. The cold plate's bonding surface precisely matches the heat sources of the H100 chip, memory, and power supply module, quickly discharging the high-density heat generated during GPU full-load operation, achieving uniform heat dissipation in the core and memory areas. It is paired with pre-fabricated liquid cooling pipeline components. The red and blue markings distinguish the inlet and outlet water ports, facilitating quick identification of the pipeline on-site and simplifying the internal pipeline layout and installation and debugging of the server. Replacing the original air-cooling solution can significantly lower the chip's operating temperature, avoid overheating throttling, and fully release the H100's AI computing power output. The thin plate's integrated structure controls the overall weight, reduces PCB stress deformation, and can seamlessly integrate into the entire machine's liquid cooling circulation system.