Intel Xeon Scalable Processors 1u Passive Server Cpu Cooler Socket Lga3647 Narrow A11

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Intel Xeon Scalable Processors 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11

The Intel 1u Passive Server Cpu Cooler is aluminum fins soldered on copper base

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Model No:: LGA3647-1U--A11

CPU Support:: Intel Xeon Scalable Processors CPU

CPU Socket:: Socket LGA3647 Narrow

Application:: 1U Server

Payment:: T/T, L/C /Paypal

Delivery time :: 3-15 days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA3647-1U-A11	Fin pitch	1.6mm
CPU Socket type	LGA3647 Narrow	CPU TDP	165W
Server Form Factor	1U Server	Voltage Rating	12V DC
CPU Cooler dimensions	108 x 78 x 25.5 mm	Heatsink material	Aluminium fins+copper base + 2 heat pipes
Weight	250g	Cooling Type	Passive
Fin Thickness	0.3mm	Process	Stamping, Soldering, CNC machining
CPU Support	Intel Xeon Scalable Processors(Intel® Xeon® Platinum 8276 Processor and so on)

▋Product Description

Intel Xeon Scalable Processors 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11

This Lori A11 cpu cooler is designed for 1U Passive Heatsink for Intel xeon scalable processors, socket LGA 3647 Narrow ILM, Aluminum stacked fin soldered on the copper base with 2 heat pipes up to TDP 165W for 1U server solution. The 1u server cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

part.1

Two heat pipes are adopted for better heat conduction. The two heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.

part.2

Th reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient

part.3

The 7762 thermal grease imported from Japan is high performance silicon.

part.4

The original imported 316 material from Japan guarantees the strong drawing force.

part.5

The fin is processed by electroplating chemical nickel, with uniform thickness, corrosion resistance, wear resistance and excellent heat conduction performance.

part.6

Base direct contact, efficient heat dissipation. the base is attached to the CPU, through the direct contact connection can make the heat conduction to the fin for heat dissipation

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CPU Cooler

Intel Xeon Scalable Processors 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11