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Intel 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11

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Intel 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11
The Intel 1u Passive Server Cpu Cooler is aluminum fins soldered on copper base
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Model No:
LGA3647-1U--A11
CPU Support:
Intel CPU
CPU Socket:
Socket LGA3647 Narrow
Application:
1U Server
Payment:
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model No

LGA3647-1U-A11

Fin pitch

1.6mm

CPU Socket type

LGA3647 Narrow

CPU TDP

165W

Server Form Factor

1U Server

Voltage Rating

12V DC

CPU Cooler dimensions

108 x 78 x 25.5 mm

Heatsink material

Aluminium fins+copper base + 2 heat pipes

Weight

250g

Cooling Type

Passive

Fin Thickness

0.3mm

Process

Stamping, Soldering, CNC machining


Product Description

Intel 1u Passive Server Cpu Cooler Socket LGA3647 Narrow A11


This Lori A11 cpu cooler is designed for 1U Passive Heatsink for Intel process, socket LGA 3647 Narrow ILM, Aluminum stacked fin soldered on the copper base with 2 heat pipes up to TDP 165W for 1U server solution. The 1u server cpu cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

       
part.1
Two heat pipes are adopted for better heat conduction. The two heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.
       
part.2
Th reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
       
part.3
The 7762 thermal grease imported from Japan is high performance silicon.
       
part.4
The original imported 316 material from Japan guarantees the strong drawing force.
       
part.5
The fin is processed by electroplating chemical nickel, with uniform thickness, corrosion resistance, wear resistance and excellent heat conduction performance.
       
part.6
Base direct contact, efficient heat dissipation. the base is attached to the CPU, through the direct contact connection can make the heat conduction to the fin for heat dissipation
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