CPU Cooler

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Lga2011 Socket Narrow ilm 1U Passive Cooling Cpu Cooler

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Model No:: LGA2011-1U-P15

CPU Support:: Intel Cpu

CPU Socket:: LGA2011 Narrow Socket

Application:: 1U Server

Payment:: T/T ,L/C /Paypal

Delivery time :: 3-15days after the deposit received

Departure port:: SHENZHEN

OEM/ODM:: Available

Certification:: RoHS and REACH compliant

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Production Information

▋Product Specifications

Model No	LGA2011-1U-P15	Fin pitch	1.75 mm
CPU Socket type	LGA2011 Narrow	CPU TDP	95 W
Server Form Factor	1U Server	Voltage Rating	12V DC
CPU Cooler dimensions	106.5 x 80 x 64 mm	Heatsink material	Aluminium fins+ Copper base + 2 heat pipes
Weight	380 g	Cooling Type	Passive
Fin Thickness	0.3 mm	Cpu hole pitch	94*56 mm

▋Product Description

Lga2011 Socket Narrow ilm 1U Passive Cooling Cpu Cooler

This Lori lga2011 cpu cooler is designed for Intel process, socket LGA 2011 narrow, The lga2011 narrow ilm cpu cooler is aluminum stacked fin soldered on the copper base with 2 heat pipes for 1U server solution. Support 95 Watts CPU Power Heat Dissipation, The passive cooling cpu has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. 2 Heat pipes cpu cooler

Adopt 2 heat pipes, superconducting composite heat pipe, excellent heat conduction performance.

1u cpu cooler

Part 2. Reflow soldering process

Use reflow soldering process, reduce oxidation, stable performance, efficient heat dissipation

Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

The 7762 thermal grease imported from Japan is high performance silicon. The original imported 316 material from Japan guarantees the strong drawing force. Copper base and fin plating chemical nickel, with uniform thickness, corrosion resistance, wear resistance and excellent heat conduction performance.

Part 4. Base direct contact, efficient heat dissipation.

The base is attached to the CPU, through the direct contact connection can make the heat conduction to the heat sink fin for heat dissipation

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