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Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler 1

Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler 2

Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler 3

Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler 4

Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler

Model No:

LGA3647-2U-A21

CPU Support:

Intel Xeon Processors Cpu

CPU Socket:

Socket LGA 3647 Narrow

Application:

2U Server

Payment:

T/T ,L/C /Paypal

Delivery time :

3-15days after the deposit received

Departure port:

SHENZHEN

OEM/ODM:

Available

Certification:

RoHS and REACH compliant

Inquiry

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Production Information

▋Product Specifications

Model No	LGA3647-2U-A21	TDP	205 W
CPU Socket type	Lga 3647 cpu socket	Voltage Rating	12V DC
Server Form Factor	2U Server	Bearing Type	2 Ball Bearing
CPU Cooler dimensions	1087864mm	Process	Stamping, CNC machining
Weight	450g	Heatsink material	Aluminum fins+ Copper base + 4 heat pipes
Fin Thickness	0.4mm	Cooling Type	Passive
Fin pitch	2.04mm	Thermal Grease	Shin-Etsu 7762 Pre-printed
CPU Support	Intel Xeon Processors( Intel Xeon Platinum 8280 Processor,Intel Xeon Gold 6256 Processor,Intel Xeon W-3275M Processor,and so on)

▋Product Description

Lori A21 Intel Xeon Processors Socket Lga 3647 Narrow ILM 2u Passive Cpu Cooler

The LGA3647-2U-A21 is the narrow ilm passive cpu cooler for 2U Server and up, designed for intel xeon processors socket lga 3647, Aluminum fin with 4 heat pipes soldered on the copper base up to TDP 205 W for 2U server solution. The intel 3647 cooler with 4 heat pipes has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1.4 Heat pipe 3647 cpu cooler

The intel socket lga 3647 narrow ilm 2u cpu cooler use 4 heat pipes, so it has better heat conduction ability, better excellent heat conduction and heat dissipation performance,The 4 high efficiency heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to transfer to the 3647 cpu cooler fins.

Part 2.Reflow soldering process

The intel 3647 cooler using reflow soldering process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the cpu cooler fin. Copper base conducts heat rapidly, Copper base zero distance contact is conducive to the heat from the CPU to conduct around the first time.

Part 3. Shin-Etsu 7762 thermal grease Pre-printed

The Shin-Etsu 7762 thermal grease of the intel socket lga 3647 cooler imported from Japan, which is the high performance silicone grease. It is Japan imported 316 material, to ensure a strong drawing force for the lga 3647 cpu cooler

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