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Lori 4th&5th Gen lntel Xeon Gold Bronze Silver Processor Fclga4677 Socket 1U Cpu Cooler D71 TDP 205W

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Lori 4th&5th Gen lntel Xeon Gold Bronze Silver Processor Fclga4677 Socket 1U Cpu Cooler D71 TDP 205W
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Model No:
LGA 4677-D71
CPU Support:
5th Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Bronze 3408U Processor
CPU Socket:
FC LGA 4677 socket
Application:
1U Server
Payment:
T/T ,L/C /Paypal
Delivery time :
3-15days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
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Production Information
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Product Specifications

Model NoLGA 4677-D71CPU TDP205W
CPU Socket typeFC LGA 4677 socketVoltage Rating12V DC
Server Form Factor1U ServerHeatsink materialAluminium fins + copper base + 4 heat pipes
CPU Cooler dimensions113*78*25.3 mmCooling TypePassive
Weight200gProcessStamping, Soldering, CNC machining
Fin Thickness0.3mmCPU 

Intel® Xeon® Bronze/Gold Processor

/5th Gen Intel® Xeon® Scalable Processor or more

Fin pitch1.5mmHeat pipe
4 heat pipes


Product Description

Fclga4677 1U Cpu Cooler
Lori 4th&5th Gen lntel Xeon Gold Fclga4677 Socket 1U Cpu Cooler D71 TDP 205W
Lori D71 LGA4677 cpu cooler is designed for 1U cooler for 4th&5th Gen Intel Xeon Gold and Cooper Lake Server Processor, FC LGA 4189 socket, Aluminum heat sink fin soldered on the copper base with 4 heat pipes up to TDP 205W for 1U server solution. The LGA4189 cooler has been fully tested and validated by Lori to ensure the best quality and cooling performance.




Product Details

LGA4677 intel xeon cpu cooler
       
Part1. LGA4677 lntel Xeon Cpu Cooler with 4 Heatpipes
Three Copper heat pipes are adopted for better heat conduction. The three copper heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently. The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
fclga4677 cooler
       
Part 2. Pre-Printed Shin-Etsu 7762 Thermal Grease
Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon. Aluminum fin heat dissipation module, adopt pure aluminum material joined heat dissipation group design, part of the temperature directly dispersed, greatly improve the heat dissipation efficiency.
Fclga4677 1U cooler
       
Part 3. Electroplating chemical nickel
The LGA41677 1U cooler is processed by electroplating chemical nickel, Nickel plating process increases beauty,oxidation resistance,and excellent heat conduction performance. The base conducts heat rapidly, and the base is zero distance from the CPU, so that the heat can be quickly transmitted to the fin for heat dissipation.
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