Lori - professional CPU cooler manufacturer since 2008. We offer OEM/ODM thermal solutions, in-house production, ISO9001 certified. 
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Amd Sp3 Passive 1u Server Cpu Heatsink For Desktop Computers
5.0
Model No:
AMD SP3 1U-C11
CPU Support:
AMD SP3 CPU
CPU Socket:
SP3
Application:
1U Server
Payment:
T/T, L/C /Paypal
Delivery time :
3-15 days after the deposit received
Departure port:
SHENZHEN
OEM/ODM:
Available
Certification:
RoHS and REACH compliant
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Production Information
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▋Product Specifications
| Model No | AMD SP3 1U-C11 | Fin pitch | 1.5mm |
| CPU Socket type | AMD SP3 CPU Narrow socket | CPU TDP | 205W |
| Server Form Factor | 1U Server | Voltage Rating | 12V DC |
| CPU Cooler dimensions | 120*80*26 mm | Heatsink material | Aluminium stacked fins+copper base + 3 heat pipes |
| Weight | 200g | Cooling Type | Passive |
| Fin Thickness | 0.3mm | Process | Stamping, Soldering, CNC machining |
▋Product Description
AMD SP3 Passive 1U Server Cpu heatsink For Desktop Computers
Lori AMD SP3 1U-C11 Server Cpu heatsink is designed for AMD SP3 CPU Server Processor, AMD SP3 CPU Narrow socket, Aluminum stacked fin soldered on the copper base with 3 heat pipes up to TDP 205W for 1U server solution. The AMD SP3 Cpu heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
▋Product Details
part.1
Three heat pipes are adopted for better heat conduction and thermal performace. The three heat pipes cover the surface of the CPU closely, greatly increasing the contact area and allowing heat to be transmitted to the heat sink fins more efficiently.
part.2
The reflow soldering process makes the contact better, the thermal conductivity is stable, the heat conversion rate is high, and the heat dissipation is efficient
part.3
Pure copper heat conduction, aluminum fin heat sink module, adopt pure aluminum material of the connected heat dissipation group design, can directly part of the temperature out, greatly improve the heat dissipation efficiency,
part.4
Inlaid copper bottom, aluminum fin, electroplated chemical nickel, uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance
part.5
Pre-Printed Shin-Etsu 7762 Thermal Grease is high performance silicon.The base is in direct contact with high efficiency for heat dissipation. The base is attached to the CPU. Through direct contact connection, heat can be quickly transmitted to the fin for heat dissipation.
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CONTACT US
E-mail: sales@lori-cn.com
Mobile phone: +86 17775668621
Mobile phone: +86 17775668621
Address: No. 6, Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, China
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