Intel Lga 1151/1155/1156 1U Server Copper Passive Cpu Heatsink

Production Information

▋Product Specifications

Model No	LGA115X-1U-P11	Fin pitch	1.9mm
CPU Socket type	LGA115X Square	CPU TDP	100W
Server Form Factor	1U Server	Voltage Rating	12V DC
CPU Cooler dimensions	88 x 88 x 23 mm	Heatsink material	Copper skiving fin + copper base
Weight	431.18g	Cooling Type	Passive
Fin Thickness	0.35mm	Process	Skiving, CNC machining

▋Product Description

Intel Lga 1151/1155/1156 1U Server Copper Passive Cpu Heatsink

This Lori P11 lga 1155 passive heatsink is designed for Intel process, LGA 1156/1155/1151 square socket . The intel lga 1155 heatsink with skiving fins and copper base For 1U server solution, Support 100 Watts CPU Power Heat Dissipation. The 1u copper heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.

▋Product Details

Part 1. Skiving fin technology

The 1u copper heatsink with high precision tight joint, fine workmanship, so that the distance of each skiving fin is consistent, the air flow evenly and smoothly through each piece of skiving fin, enhance the thermal performance, with one-time molding, No loss of heat dissipation performance, good heat dissipation effect.

Copper cpu heatsink

Part 2. 23mm Thin Height

The copper cpu heatsink's height is only 23mm structure design, good cooling performance, suitable for compact space and small size CPU heat dissipation.

Part 3. Pre-Printed Shin-Etsu 7762 Thermal Grease

The 7762 thermal grease imported of the Lga 1155 passive heatsink from Japan is high performance silicon. Nickel plating Nickel plating process for increased beauty and oxidation resistance

Part 4. Copper base conducts heat rapidly

Zero distance contact of copper base is conducive to the heat generated by CPU to conduct around in the first time, attach to CPU heating core, absorb and conduct every minute of heat in time.

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CPU Cooler

Intel Lga 1151/1156/ 11551U Server Copper Passive Cpu Heatsink Lori